Tom Hamilton Evaluation Quotations

With the tape-out of our UWB digital chip, we can now tackle the wireless applications and product opportunities demanding high performance UWB solutions. Modules will be assembled shortly after we receive first silicon. Evaluation and product development kits containing both UWB chips are expected to be available for shipment by the end of second quarter 2006.

First silicon of our analog UWB chip stands as the culmination of a tremendous engineering effort. Receiving this chip on time for validation testing is a major step toward UWB commercialization. We look forward to receiving our digital chip and shipping evaluation kits to our customers.